Olympus Integrated Technologies America Delivers IR Inspection and Measurement System to SEMATECH for 3D-TSV Interconnect Program at UAlbany NanoCollege

Jul 10

JupetongCollege, Education No Comments

Olympus Integrated Technologies America, Inc., a subsidiary of Olympus Corporation of the Americas and a leader in advanced inspection and defect review systems, announces that it has provided an infrared (IR) inspection and defect review system with metrology software to SEMATECH, the global consortium of semiconductor manufacturers, for its 3D R&D Center at the College [...]

SEMATECH Acquires TSV RIE Tool From Tokyo Electron Limited

Oct 29

JupetongCollege, Online Education No Comments

SEMATECH, in partnership with the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, is pleased to announce that it has received a 300 mm Telius™ SP UD system from Tokyo Electron Limited (TEL).
The Telius SP UD system is the latest generation through-silicon-via (TSV) etch tool that has the versatility to investigate [...]